Cross-section sample preparation using focused ion beam system (FIB) for transmission electron microscopy (TEM)
Содержание
- 2. What is TEM? TEM Hitachi HT 7700 What can be observed by TEM: Thin films and
- 3. Supporting grid for TEM specimens TEM specimen holder
- 4. Examples Ni nanoparticles (catalysts) and carbon nanotubes Ni-Ti thin foil Neonothopanus nambi (lat.) biological specimen Co-Al2O3
- 5. What is “cross-section”? cross-section is basic method of observation multi layers structures cross-section method allows to
- 6. Classic method of cross-section sample preparation Four pieces of specimens on the silicon substrate are glued
- 7. 3 sawing disc of 100 um thickness 4 Thinning the disk up to 10 microns by
- 8. 5 Thinning the disk up to 10 nm by Precision Ion Polishing System (PIPS)
- 9. Modern method of cross-section sample preparation Focused Ion Beam System (FIB) Hitachi FB 2100
- 10. Basic steps of cross-section sample preparation by FIB 1. Deposition of protective tungsten coating on the
- 11. 2. Cutting half-finished (lamella)
- 12. 2. Cutting lamella (continuation)
- 13. 3. Fixing microprobe
- 14. 4. Cutting left side and removing lamella
- 15. 5. Fixing lamella on the toothed semicircle
- 16. 6. Cutting and removing microprobe
- 17. 7. Thinning specimen to 50-100 nm
- 18. Finish result Область просмотра в ПЭМ Disadvantages of FIB method Damaging top layer during deposition tungsten
- 19. Some features sample preparation with thin layers (thickness less than 300 nm)
- 22. Pre-sputtering of Ge protective layer
- 23. substrate (Si) Ge (protection layer) Mn (epitaxial layers) Examples
- 24. substrate (Si) Ge (protection layer) Co Pt
- 25. comparison of the two methods Classic method FIB method
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