ESD Class 0 Protection Stress Levels

Содержание

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ESD Event Classification From EMI to EOS - Speed Classification EMI

ESD Event Classification

From EMI to EOS - Speed Classification
EMI caused ESD

has short and repetitive pulses with low energy.
EOS is and ESD event with unlimited Current/Time constrains
HBM, MM & CDM model typical events in the manufacturing areas.

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* NASA Workmanship Standards Introduction 1What is an ESD Sensitivity Level?

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Introduction

1What is an ESD Sensitivity Level?
2How is it

obtained?
3Why is it important to the user?
4Why different test models?
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* NASA Workmanship Standards Overview ESD Models Provide a way to

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Overview

ESD Models Provide a way to characterize the

sensitivity of components to ESD
The different ESD models simulate the different environments experienced by electronic components during the manufacturing process.
Parts and assemblies may be exposed to more than one type of ESD event over the manufacturing and test life cycle.

CDM

MM

HBM

ESD Models:
(differences & interrelation)

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* NASA Workmanship Standards Purpose of ESD Models Models establish Benchmarks

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Purpose of ESD Models

Models establish Benchmarks for ESD

Sensitivity.
Different Models are used to simulate different work environments.
Models provide help to prevent and analyze ESD Failures
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* NASA Workmanship Standards Human Body (HBM): discharging event through the

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NASA Workmanship Standards

Human Body (HBM): discharging event through the body

and the part to ground.
Machine (MM): discharge voltage through automated handling equipment or hand-tools and the part to ground.
Charged Device (CDM): discharge into or out of a part due to charge accumulation within the part itself.

ESD Event Test Models

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ESD Damage to Die Structure Damage types can vary depending on

ESD Damage to Die Structure

Damage types can vary depending on event

models.
Long, higher Voltage HBM event can look like electrical overstress at die periphery.
Fast, high Current CDM event causes defects in core area which can be latent failures.
Must use advanced FA techniques to locate sites.
A Comparison of Electrostatic Discharge Models and Failure Signatures for CMOS Integrated Circuit Devices, M. Kelly, G. Servais, T. Diep, S. Twerefour, D. Lin, G. Shah, EOS/ESD Symposium 95

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ESD Sensitivity Levels * NASA Workmanship Standards

ESD Sensitivity Levels

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* NASA Workmanship Standards White Paper 2: A Case for Lowering

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White Paper 2: A Case for Lowering Component Level

CDM ESD Specifications and Requirements, Industry Council on ESD Target Levels, March 2009
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* NASA Workmanship Standards Models Comparisons Courtesy of ESDA

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Models Comparisons

Courtesy of ESDA

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ESD Models vs. Sources of Threats * NASA Workmanship Standards

ESD Models vs. Sources of Threats

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“Class 0” Parts Protection “Class 0” has become the generic term

“Class 0” Parts Protection

“Class 0” has become the generic term to

define parts which are very sensitive to ESD.
It now encompass parts sensitive to HBM <250v as well as parts damaged by EMI
Sensitivity for these parts needs to be also defined using CDM classifications.
{EPAs as currently implemented at GSFC can protect parts sensitive to ~100 V HBM}

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Model Implementation NASA-HDBK-8739.21 (in Approval Cycle) Guide for Creating an ANSI/ESD

Model Implementation

NASA-HDBK-8739.21 (in Approval Cycle) Guide for Creating an ANSI/ESD

S20.20 Implementation Plan
Focus is on HBM: emphasis on operator grounding, dissipative surfaces, reduction of triboelectric charging
For HBM & MM the methods for protective practices and creating protective spaces are highly reproducible and “low tech”
Proper implementation requires training and follow-up
HBM safety methods have brought HBM & MM failures down (now are ~10% of failures encountered industry-wide)

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Model Implementation Recent failures of high speed devices (LVDS, FPGAs) drive

Model Implementation

Recent failures of high speed devices (LVDS, FPGAs) drive users

to Class 0 HBM…
…But IC manufacturers calculate that about 90% of the failures from the field are due to CDM ESD events.
CDM-related field returns are associated with low, medium, and high sensitivity devices.
Safety methods for CDM are highly customized because the model is less mature (many unknown variables and variable relationships, rapidly changing characteristics

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Class 0 & CDM Class 0 refers to the HBM model

Class 0 & CDM

Class 0 refers to the HBM model
Currently most

ESD damage is caused by much shorter pulses best defined in the CDM model.
ESD pulses can be clamped by internal shunts and bypasses at the expense of design complexity and speed.
There is a limit beyond which the device cannot be internally protected.

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Limits of Design-in Protection CDM protection by the design is driven

Limits of Design-in Protection

CDM protection by the design is driven by

the peak current from the IC package discharge at the CDM voltage targeted.
The larger the package the higher the peak current of the CDM pulse created.
The smaller the geometry of the circuit the lower the breakdown voltage of the circuit
Present Theoretical Limit ≈ 125v CDM

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Protection of Devices Sensitive to Class 0 ESD “Shalls” related to

Protection of Devices Sensitive to Class 0 ESD

“Shalls” related to

HBM Class 0 protection:
Dissipative chairs and stools
Conductive or dissipative floors or floor mats
Relative humidity
Ionizers
Smocks
Procedures for Mating and de-mating of harnesses
Soldering iron testing
Signage

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External ESD Control Measures for Extremely Sensitive Devices * NASA Workmanship Standards

External ESD Control Measures for Extremely Sensitive Devices

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Charged Board Events CBE are caused when a board is pulled

Charged Board Events

CBE are caused when a board is pulled from

the bag and place on a conductive surface
This ESD hazard was often overlooked
During FA the components failure is usually classified as EOS damage.
Recent data reported by several Companies indicates that CBEs are commonly missed in FA

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* NASA Workmanship Standards Where to Get More Information WEB searches

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Where to Get More Information

WEB searches under “ESD Models”
ESDA

publications
Consulting services provide Advice on tough ESD problems and Solutions.
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* NASA Workmanship Standards References ANSI/ESD STM5.1-2001 ESD Sensitivity Testing (HBM)

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References

ANSI/ESD STM5.1-2001 ESD Sensitivity Testing (HBM)
ANSI/ESD STM5.2-1999 ESD Sensitivity

Testing (MM)
ANSI/ESD STM5.3.1-1999 ESD Sensitivity Testing (CDM)
ANSI/ESD SP5.2.2-2004 ESD Sensitivity Testing (SDM)
ANSI/ESD SP5.5.1-2004 ESD Sensitivity Testing (TPL)
Scott M. Hull, “ESD Failures in Thin-Film Resistors” NASA/Goddard Space Flight Center
http://esdsystems.com/whitepapers/
http://www.semiconfareast.com
http://www.ce-mag.com/archive/01/09/henry.html
http://www.ce-mag.com/ce-mag.com/archive/01/03/0103CE_046.html
White Paper: Industry Council on ESD Target Levels on CDM
http://ossma-dev.gsfc.nasa.gov/ESDResources/index.php
https://ossmacm.gsfc.nasa.gov/
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Thank you Any Questions? * NASA Workmanship Standards

Thank you Any Questions?

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* NASA Workmanship Standards Typical HBM Generated Failures 2000X 100X Courtesy

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Typical HBM Generated Failures

2000X

100X

Courtesy of JPL

Scott M. Hull NASA/GSFC

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* NASA Workmanship Standards Typical MM ESD Stress Failure Scott M. Hull NASA/GSFC

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Typical MM ESD Stress Failure

Scott M. Hull NASA/GSFC

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* NASA Workmanship Standards Typical CDM generated failures 4600x 8600x Courtesy of JPL Courtesy of JPL

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Typical CDM generated failures

4600x

8600x

Courtesy of JPL

Courtesy of JPL